An edition of Force Sensors for Microelectronic Packaging Applications (2004)

Force Sensors for Microelectronic Packaging Applications

by , , and

Force Sensors for Microelectronic Packaging A ...
Jürg Schwizer, Michael Mayer, ...
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Last edited by ImportBot
September 11, 2021 | History
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An edition of Force Sensors for Microelectronic Packaging Applications (2004)

Force Sensors for Microelectronic Packaging Applications

by , , and

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Publish Date
Publisher
Springer London, Limited
Language
English

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Subjects

Electronic packaging, Metal bonding
Edition Availability
Cover of: Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Dec 15, 2010, Springer
paperback
Cover of: Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
2004, Springer London, Limited
in English

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Book Details

Classifications

Library of Congress
TA401-492

The Physical Object

Pagination
viii, 178

Edition Identifiers

Open Library
OL35753542M
ISBN 13
9783540269458

Work Identifiers

Work ID
OL20803912W

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Better World Books record

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September 11, 2021 Edited by ImportBot import existing book
May 31, 2020 Created by ImportBot import new book